Thanks for the offer Juergen. Indeed thanks to all who have offered
assistance including the offer of etching tools. Much appreciated.

Unfortunately I have a CMOS chip on which the oxide layers are
pre-defined by the foundry. So I can't use lift-off technology to define
the oxide, I can only etch the oxide.

Good to know that 100 microns of SiO2 can be lifted off though!

Thanks again,

James

Juergen Leib - MSG Lithoglas AG wrote:
> Dear James,
>
> would it be possible to a Lift-Off technology on your thick oxide?
> I did not fully understand how you apply your oxide, but in case it can be
> done after your other processing is completed, I suggest the following:
> * Deposition of SiO2 by e-beam evaporation
> * Lift-Off of the Openings
>
> We did a deposition of 100um (!) oxide already, so 10um is no real
> challenge.
> Due to our optimized e-beam deposition we can use a photoresist for
> lift-off.
> Please contact us, we would be happy to support your efforts.
>
> Juergen
>

Dr. James Paul Grant
Postdoctoral Research Associate
Microsystems Technology Group
76 Oakfield Avenue Room 3
University of Glasgow
Glasgow
Scotland
G12 8LS

Telephone: +44(0)141 330 3374