Hi,

Hopefully you can help me!

We normally do aluminum wedge bonds from die to substrate and it works
very well. However, due to the mechanical limitations on a current
package on which we are currently working on, we were considering having
to bond from substrate to the IC die. Is there any norm or design rule
that does not permit doing so?

I would really appreciate if you could give me some advice on that!

I am looking forward to your feedback,

Have a very nice day!

Sonia Garcia Blanco, PhD
Researcher MOMS

INO
2740 rue Einstein
Quebec, G1P4S4, CANADA
phone: 418 6577406 x591
fax: 418 6577009