If I understand your question, you are just reversing the order of the bonds. It sounds like it should work fine. Regards, Steven J. Adamson Market Manager, Asymtek First Past President IMAPS Device Packaging Conference Global Business Council March 8-12, 2009 Scottsdale , AZ www.imaps.org/devicepackaging -----Original Message----- From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On Behalf Of GARCIA BLANCO Sonia Sent: Tuesday, February 24, 2009 12:47 PM To: General MEMS discussion Subject: [mems-talk] Aluminum wedge bonding from substrate to die Hi, Hopefully you can help me! We normally do aluminum wedge bonds from die to substrate and it works very well. However, due to the mechanical limitations on a current package on which we are currently working on, we were considering having to bond from substrate to the IC die. Is there any norm or design rule that does not permit doing so? I would really appreciate if you could give me some advice on that! I am looking forward to your feedback, Have a very nice day! Sonia Garcia Blanco, PhD