dear friends, we are trying to plate Ni (electroless) on n-type Si wafer, we do observe Ni deposition but there are adhesion issues on as deposited samples and some times poor ahesion on annealed samples. Has anyone had a similar problem....? if yes what was the solution... thank you Vikrant A. Chaudhari Research Scholar Energy Systems Engg Indian Institute of Technology Bombay Mumbai-400076 India Tele-+912225764888 www.ese.iitb.ac.in/~vikrant