Are you using an adhesion layer such as Chrome or Titanium. You may want to deposit a thin layer (10 - 20 nm) before Ni deposition. I know this helps with thermal and e-beam evaporation but I am not sure that it will help for your plating method. On Thu, Jun 11, 2009 at 12:32 PM, Vikrant A. Chaudhariwrote: > dear friends, > > we are trying to plate Ni (electroless) on n-type Si wafer, we do observe > Ni deposition but there are adhesion issues on as deposited samples and > some times poor ahesion on annealed samples. Has anyone had a similar > problem....? if yes what was the solution... > > thank you > > Vikrant A. Chaudhari -- EVELYN BENABE Graduate Research Assistant RF Microsystems Research Group University of South Florida 4202 East Fowler Avenue Tampa, FL 33620 Office: ENB 412 Office Phone: (813)-974-4851