I think almost any wafer dicing saw can do what you are asking.

Regards,
Steven J. Adamson
Market Manager, Asymtek

First Past President IMAPS

iKNOW Microelectronics
The first Place to look for Packaging Information
www.iknowmicro.org


-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of Petru Lunca Popa
Sent: Tuesday, June 23, 2009 12:53 AM
To: General MEMS discussion
Subject: [mems-talk] Cutting Silicium pieces

Hi everyone

I am working with devices built by depositing Au on Si/SiO2 wafers .On a
2cm/2cm piece of Si I am having 4 devices so I need to cut . Does anyone
can reccomand me a good and precise cutting machine?
I need a precision of half of milimeter (the distance between samples is
1mm). Also I am performing some FIB or Ebeam on those samples so I want
to avoid strong vibrations.

So Anyone knows a good machine to cut ? Or a method what can help me?

Thank you
Petru