Dear Nidhi,

If you have metal in your channels or on
wafers, then anodic bonding would serve
as a good option for hermetic sealing.
but you gotta take care of the unbonded
 area around the metal pads which will
obviously depend on pads dimension.

in your case, since the metallization is in channels then u wont have to
worry for the unbonded area.
except microchannels rest of the wafers will be bonded.
actually, i have been bonding metallized silicon wafers with pyrex 7740.

i would like to know the thickness of oxide which u r growing in silicon
before bonding.

Tarun