Hi Kim

Try:

1. Hardbake the resist.
2. Improve the cooling of your wafer, for example, do a better
cleaning of the back of your wafer.
3. Use a recipe with higher selectivity.

Best
Leo

On Mon, Jul 20, 2009 at 11:20 AM, Taekyung Kim wrote:
> Hello folks,
>
> I'm trying to do Si deep RIE with AZ9260 photoresist as a mask in a
> PlasmaTherm etcher.
> Any good recipe for AZ9260 PR?
>
> The recipe I used was as follows.
>
> 1. AZ9260 spun at 2000 rpm for 60s (~11um)
> 2. 110C 5 min softbake
> 3. 540mJ/cm2 exposure
> 4. AZ 421K developer ~3min
> 5. No hardbake.
>
> The smallest feature size is 20 un wide lines.
>
> The mask would barely hold up to 200 cycles of etching.
>
> Thanks
>
> TK

--
Xiaoguang "Leo" Liu
Birck Nanotechnology Center,
Purdue University,
1205 W.State Street, West Lafayette, IN, 47906 USA
liu79@purdue.edu