Hi I am trying to deposit about 5.0 um thick Aluminum film on 20um photoresist/polymer. But the metal layer does not adhere well on photoresist/polymer and peels off. Some of the methods I have tried to improve the adhesion are degas, preclean, Ti glue layer etc. Because of the photoresist, I can not increase the substrate temp more than 150C. Has any one come across this kind of problem and possible solution? With regards, Pramod