Hello Lin,

We do have already some years using this Electro Deposition resist.
Works fine, but some time a lot of pinholes are observed.
Mostly caused by a surface which is not clean.
Best performance was seen on a Cu seedlayer, but we also deposited on Au, Ti and
other conductive layers.

Best regards,

Peter Kuijpers
MiPlaza Technology Laboratories
Philips Research Europe
High Tech Campus 04
Postbox HTC-4-1
5656 AE Eindhoven
The Netherlands
Tel.: +31 402743667
         +31 612507027
Email: p.e.m.kuijpers@philips.com


-----Original Message-----
From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On
Behalf Of lin yu
Sent: Wednesday 20 January 2010 19:21
To: General MEMS discussion
Subject: [mems-talk] Electroplating Photoresist on conductive surface

Hi all,

Does anyone have any experience of electroplating PR on conductive surface?
The idea is to cover the conductive surface with some kind of PR and then
etch the other Si areas in DRIE. The normal mask for DRIE is SiO2 or silicon
nitride. But I cannot just cover the metal region without covering the Si. So
I'm thinking using some kind of electroplatable PR. I found this PR called
INTERVIA(tm) 3D-P PHOTORESIST.  Has anyone used it before?

I really appreciate if anyone could provide any suggestion on this process.

Thanks,
Lin