Andy,

We developed a polishing process for a back-emitting VCSEL after thinning wafers
to <80µm.  Our polish was better than 80Å Ra.  Handling them after demount was
brutal.

Brad Cantos
brad.cantos@holage.com
http://holage.com


On Jan 21, 2010, at 7:23 AM, Andy Irvine wrote:

> Thanks Brad and Brent for some good ideas.  I guess mechanical is the way to
go - I can access the right sort of grinding sludge.
>
> Brad - if you managed that, I take my hat off to you!
>
> Cheers all,
>
> Andy