Andrea, Yes. Any particles on the surface of the wafer before or during deposition will compromise the continuity of the film and allow penetration of the etchant. Dan -----Original Message----- From: Andrea Mazzolari [mailto:mazzolari@fe.infn.it] Sent: Monday, April 05, 2010 11:04 AM To: Ruiz, Marcos Daniel (SENCOE) Cc: mems-talk@memsnet.org Subject: RE: [mems-talk] metallic mask Hi Dan, do you mean that there could be some particles on the wafer surface ? Best regards, Andrea