Hi guys,

I am wondering which micromechanical processes exist to obtain high-storage
multistack capacitors. I imagine you may realize it or by employing multiple
lithographic steps for each metal plate / dielectrics, or, by patterning,
transferring and bonding of a lot of single plates into
multi-stacks.


I could not find any methods, reports, papers around describing the actual
methods of small footprint capacitors. Any help and references are highly
welcome.

Bye

Daniel