I have recently been using NR9-1500PY resist from Futurrex for lift-off
metallization and wanted to see if anyone else has the same experience
that I am having with the resist. I am using a Bachur upright exposure
unit with near UV exposure, vacuum contact printing, and hotplates for
the PAB and PEB. I have been developing using full strength TMAH based
developer. My experience thus far is that the process latitude is very
small for getting the resist to work properly. I have noticed a
significant difference in the amount of undercut based on exposure and
develop times, and a also occasionally the resist just seems completely
over exposed and unable to develop at all. I also notice quite a bit of
variation in the amount of undercut over a 7"X7" area. I am just curious
if I am missing something in my process control that is common, or if
this is just the nature of using this type of LOR.



Sincerely,

David Casale
R&D Engineer
www.maxlevy.com 
Max Levy Autograph
2710 Commerce Way
Philadelphia, PA 19154 USA
tel: 215-842-3675