Hi Darren,

I have used PI-2611 for my project.

Don't use any of adhesion promoter before your spinning if you want to
peel the PI.

After your fabrication steps, you can try some sharp
tools to remove it from the wafer carefully.

The trick is your device may peel off when ultrasonic or auto washing
are used.

And be careful when acetone is used  during the fabrication, because
even well cured PI will absorb small amount of acetone which may peel
your device off the wafer. This will happen more when any bubble appears
 on your wafer after the spinning.

Hopefully it will help a little bit.

Huihang

> From: d.alvares@student.unsw.edu.au
> To: mems-talk@memsnet.org
> Date: Thu, 3 Jun 2010 10:09:55 +1000
> Subject: [mems-talk] P1-2525 remove from Si
>
> Hi All,
>
> Just have a question about removing polyimide from an Si Wafer and wanted to
know if anyone had experience with this? I would spin and bake the PI on the
wafer. After fabricating the device I wanted to peel the PI with the device of
the wafer (so it is on a flexible substrate)
>
> Are there any special tricks or rigs that you use?
>
> Any help I am sure would be very useful
>
> Thanks,
>
> Darren Alvares