Hello,

In here at MiPlaza we use a paryleen coating (2-5µm) for protecting
the frontside.

Removal can be done with a simple O2 plasma.

Regards,


Peter Kuijpers
MiPlaza Technology Laboratories
Philips Research Europe
High Tech Campus 04
Postbox HTC-4-1
5656 AE Eindhoven
The Netherlands
Tel.: +31 402743667
         +31 612507027
Email: p.e.m.kuijpers@philips.com

-----Original Message-----
From: mems-talk-bounces+p.e.m.kuijpers=philips.com@memsnet.org [mailto:mems-
talk-bounces+p.e.m.kuijpers=philips.com@memsnet.org] On Behalf Of K.Vossough
Sent: Tuesday 16 November 2010 9:45
To: 'General MEMS discussion'
Subject: [mems-talk] Front side KOH mask for backside membrane etch


Does anyone know the latest, or the most production compatible KOH mask for
protecting the metallized front side of the wafer ? Our last process step
requires back etch of the SOI handle wafer down to BOX layer to form thin
membranes and we need a front side protection coating other than the commonly
used nitride, oxide and metal masks. Clean removal in batch processing of this
mask after KOH etch is also critical.

Thanks,

Kris K. Vossough, Ph.D.
Principal
Nano and Micro Technology Consultants
E-mail: vossough@memswork.net
Voice: (408)373-5413
Fax: (650)798-5001
http://www.memswork.net