Hi All,

We sputtered CrAu metal films onto the surface of a silicon dioxide layer which
is on the top side of silicon wafers.  The Au metal film was then thickened by
electroplating to about 3 microns.
We did the adhesion test by spot-wielding Au tape and pulling the Au tape.
Sometimes the film under the wield spot were pulled off, sometimes not. While
doing the Thermosonic tape bonding and pulling test, it shows that the film
adhesion is good.

It seems that some batch of CrAu films couldn't bear temperature shock by spot-
wielding.
How could we improve the tolerance of CrAu films to High temperature shock?

Has anyone had similar experience?

Is it suitable to spot-wield Au tape onto silicon dice?

Thanks!