Hi Peter, My best guess - Your O2 plasma is causing the de-adhesion. I'm guessing that the O2 plasma is making the surface of the PECVD off-stoichiometric oxide more stoichiometric and causing a delaminating layer. The stress of the Cr then pulls it up easily. So I would try skipping the ash and/or using a low stress Cr deposition process. Good luck! Felix On Feb 1, 2012, at 5:30 AM, Kuijpers, Peter wrote: > Hi all, > > At this moment we evaporate a 10nm Cr/200nm Pt film onto > a PECVD applied SiO2 layer. > > But afterwards we observe sever adhesion problems, despite > an O2 plasma prior to evaporation. > > Does someone has another suggestion to improve adhesion of the Cr/Pt film > towards the SiO2 layer? > > We cannot use a sputter process. > > Many thanks in advance. > > Peter Kuijpers > Process Integrator > Philips Innovation Services ---------------------------- Felix Lu felix_lu@yahoo.com