Hello Pietro,

If I understand your requirement correctly then you should be able to
achieve it using an AML in-situ aligner bonder.

Regards

Tony

-----Original Message-----
From: mems-talk-bounces+tony=aml.co.uk@memsnet.org
[mailto:mems-talk-bounces+tony=aml.co.uk@memsnet.org] On Behalf Of
Pietro Maoddi
Sent: 07 February 2012 09:45
To: mems-talk@memsnet.org
Cc: matthieu.nannini@mcgill.ca
Subject: Re: [mems-talk] Low temperature Al-Al bonding

Hello,

I considered that option but it seems a little homebrew: the SB6
alignment
jig  is kind of
delicate
and not fit for putting weights on it (the wafers are clamped in the
center
of a ring), so I would have to somehow remove the wafers from the jig
without losing alignment to put them in an oven.

That's why I'm looking for a more "industrial" technique.

Best,
Pietro