Dear Leo,

before you try this technique (I was ready to use it for my wafers for
the backside of SOI in order to etch the silicon 550um), there are other
techniques such as DRIE (Deep Reactive Ion Etching) plus if you think
that you will have problem with the resist I can send some information
about multiple spin coating like 3 times in the raw. I used 10um of
SPR220. After some tries it worked really well for Si bulk wafer and now
for SOI. I am not suggesting CMP because you will make very fragile your
wafer, specially if you have some membranes like me!

Best Regards



Στις 3/12/2013 3:45 AM, ο/η Xiaoguang Liu έγραψε:
> Dear MEMS community
>
> Our lab has been thinking about acquiring a chemical mechanical polishing
> tool. We are tight in budget so I'm wondering what would be an economical
> solution. Would it be possible for us to build one ourselves? What caveats
> do we need to look for if we are looking for a second-hand one? We are
> interested in planarizing photoresist (with plated metal) and silicon
> primarily. We typically process small pieces of samples (1in^2 or so) and
> seldom do full wafers.
>
> Many thanks.
>
> Leo
>

_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

Want to advertise to this community?  See http://www.memsnet.org

To unsubscribe:
http://mail.mems-exchange.org/mailman/listinfo/mems-talk