Hello All, How to make the surface of the glass substrate rough (by up to 200 nm) ? And how does this roughness influence the anodic bonding process and its interface ? I could imagine that higher roughness in the order of few hundreds of nm would create contact issues between Glass-Si wafers and lead to voids . Any useful info, pointer or reference literature, you can provide is much appreciated. Thanks a lot! VJ _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk