Hi, Borosilicate glass's surface can be roughened by wet etch, but what is the purpose of this need? A fresh generated layer of approximately 20 nm silicon dioxide is generated between Si and borosilicate glass. This is why recommendation for anodic bond surface roughness to be 10 nm or better. Roughness of 200 nm will have potential void and leakage issues at interface. You can try increase temperature and current to get more SiO2 to fulfill interface (doubtful for 200 nm) but your glass and Si may warp due to high temperature. Let me know if you need more assistance and good luck. Best Regards, Tian Tang EV Group invent • innovate • implement Applications Engineer - Direct: +1 (480) 305 2455, Main: +1 (480) 305 2400 Fax: +1 (480) 305 2401 Cell: +1 (480) 274 3892 E-Mail: T.Tang@EVGroup.com Web: www.EVGroup.com On Mar 13, 2013, at 10:42, Vijay Rajaramanwrote: > Hello All, > > How to make the surface of the glass substrate rough (by up to 200 nm) > ? And how does this roughness influence the anodic bonding process and > its interface ? > > I could imagine that higher roughness in the order of few hundreds of > nm would create contact issues between Glass-Si wafers and lead to > voids . > > Any useful info, pointer or reference literature, you can provide is > much appreciated. > > Thanks a lot! > VJ > _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk