How about using spin coated HSQ? After proper baking it will become
somewhat like SiO2 and it can endure photo lithography process I think.
Also with HF it will be removed and in pronciple HF will not attack Si and
PR. Main concern is whether conventional HSQ resist like FOX series is
available for you and whether it can fill the pore you have.

Best.
Myung rae
2013. 5. 24. 오후 11:11에 "Xiao" 님이 작성:

> Thanks Andrew and Robert,
> The substrate I'm working on is porous silicon, I have tried
> (1) Prolift100 series (which can fill pores of porous silicon, and be
> removed by TMAH developer, but it becomes difficult to remove Prolift in
> thick substrate with fine photoresist features on top, besides, long
> developing time will damage the substrate and photoresist patterns).
> (2) VM-651 (which can fill pores but is difficult to be removed after soft
> bake).
>
> I considered BARCs before, however, I'm afraid that it will introduce the
> same problem as Prolift, so it would be better if this material can be
> removed by other solvent but not developer, so it won't affect the
> photoresit patterns.
>
> Best regards,
> Xiao
>
>
>
> On 23 May 2013 22:45, Black, Robert  wrote:
>
> > There are developable BARCs out there, but they only coat about 60nm. You
> > may have to double coat them. They are removed with developer.
> >
> > -----Original Message-----
> > From: mems-talk-bounces+r-black1=ti.com@memsnet.org [mailto:
> > mems-talk-bounces+r-black1=ti.com@memsnet.org] On Behalf Of Xiao
> > Sent: Wednesday, May 22, 2013 3:14 AM
> > To: mems-talk@memsnet.org
> > Subject: [mems-talk] high viscosity material
> >
> > Hello everyone,
> >
> > I am trying to find a high viscosity material that can fill pores
> (<100nm)
> > of a substrate, then do patterning with photoresist on it, and removed
> this
> > material with some solvent or even DI water, but not affecting the
> > photoresist patterns.
> >
> > We have tried several materials for now, but didn't work very well, do
> you
> > have any ideas of this material? Thank you!
> >
> > Best regards,
> > Xiao
> > _______________________________________________
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> Hosted by the MEMS and Nanotechnology Exchange, the country's leading
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