Dear Friends,

I am starting to use Ansys for the modeling of MEMS micromirror
static/dynamic analysis. There have been many previous work in this field,
but according to my observations, 3 key technologies were basically used
for MEMS electromechanical coupling, which are 1. using Coupled Field
Element (SOLID226); 2. Multi-field solver; and 3. Trans126.

Seems for method #1 I have to use air to enclose the whole device if fringe
electric field needs to be considered, but in "Gyimesi, Miklos, Ilya
Avdeev, and Dale Ostergaard. "Finite-element simulation of
micro-electromechanical systems (MEMS) by strongly coupled
electromechanical transducers." Magnetics, IEEE Transactions on 40.2
(2004): 557-560." it says in large deformation bending electrode problem,
Trans126 might not be suitable.

Do you guys have any previous experience on this selection issue? Besides,
seems Trans126 also requires the pre-stress definition, which I am still
struggling to find out where to apply...
_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

Want to advertise to this community?  See http://www.memsnet.org

To unsubscribe:
http://mail.mems-exchange.org/mailman/listinfo/mems-talk