Dear Colleague,

I am new in that field and I need help in the following cases


*Case A:*

Metal layer (not specific layer) is deposited on a Silicon wafer. After
that, we add a layer of photoresist and this layer has particles in
different levels. We put the device in Mask aligner using mask to expose UV
light.



*Case B*

Same as case A but there is no metal layer between the Silicon wafer and
the photo resist.


*How can I indicate the resultant morphologies of the Photoresist pattern
on wafer each case?*

Thank you,
Regards

Hadi
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