Elhadi-

First-  Are you working in a fairly clean area?   Assuming that you are printing
larger features (>5 um) Then for both cases, I assume your resist thickness is
at least 1 um.  In that case the resist will likely be a conformal coating,
unless the particles are close to 1 um high, or bigger.  If you have access to
general micro fabrication literature, there are many references which will steer
you in the right direction regarding patterning.  In addition Google will give
you a wealth of reference.  Best of luck this is an interesting field!

Tim Eschrich
Associate Research Scientist
Arizona State University Biodesign Institute
Tempe AZ

---- Elhadi hadi  wrote:
> Dear Colleague,
>
> I am new in that field and I need help in the following cases
>
>
> *Case A:*
>
> Metal layer (not specific layer) is deposited on a Silicon wafer. After
> that, we add a layer of photoresist and this layer has particles in
> different levels. We put the device in Mask aligner using mask to expose UV
> light.
>
>
>
> *Case B*
>
> Same as case A but there is no metal layer between the Silicon wafer and
> the photo resist.
>
>
> *How can I indicate the resultant morphologies of the Photoresist pattern
> on wafer each case?*
>
> Thank you,
> Regards
>
> Hadi
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