following situations may be true: 1. the mask you prepared if by (wet etching ) might have different dimensions than conceived in design. 2. you are under etching after exposure, in that increase time for etching in SU8 developer. 3. you have a heating process after etching. On Mon, Jul 28, 2014 at 12:58 PM, Janis Klavinswrote: > Hello all, > > I have a strange problem with SU8 structures. When we expose and develop > the structure it is wider than necessary in SEM image it is possible to see > that those wider areas are somehow different and the side of the structure > is "fluffy" not straight and even. (see the image below. > I believe it might be one of the following: > 1) Over-exposure: I cannot change exposure time due to additional adhesion > problems > 2) Mask is in proximity instead of contact mode: thickness of coating > varies by 1 um (I do not think that it should make such a problem) > 3) Something wrong in Post-exposure (too long or too hot) > > Does anyone with greater experience with SU8 could suggest anything? > > > -- > Best regards, > Mr. Janis Klavins > EuroLCDs > Phone: +37163600300 > Mobile: +37126141049 > > _______________________________________________ > Hosted by the MEMS and Nanotechnology Exchange, the country's leading > provider of MEMS and Nanotechnology design and fabrication services. > Visit us at http://www.mems-exchange.org > > Want to advertise to this community? See http://www.memsnet.org > > To unsubscribe: > http://mail.mems-exchange.org/mailman/listinfo/mems-talk > _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk