Hi, Ashok What is the aspect ratio of your TSV structure? You may try SF6+O2 process with oxide as mask. The profile will be sacrificed although with non-bosch process. Regards! Lillian -----Original Message----- From: Ashok . [mailto:ashok@sitarindia.com] Sent: Wednesday, May 03, 2017 3:46 PM To: mems-talk@memsnet.org Subject: [mems-talk] Through Silicon Via using Non-Bosch recipe Dear mems-talk community, I am using SPTS(Orbotech) DRIE ICP etcher for etching TSV but using Bosch process. since my device process' requirements are with scallops < 20nm, I am looking for a recipe (non-bosch) which uses both Etch and Depo steps simultaneously. Could you please guide me in this about the possibility of developing the same? Thanks in advance, Regards, Ashok Kumar D, _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk