durusmail: mems-talk: -|EXT|- Through Silicon Via using Non-Bosch recipe
Through Silicon Via using Non-Bosch recipe
2017-05-03
2017-05-04
-|EXT|- Through Silicon Via using Non-Bosch recipe
2017-05-04
-|EXT|- Through Silicon Via using Non-Bosch recipe
MCNIE Mark
2017-05-04
Hi Ashok,

There are a few possible approaches here.

The first is to slow the etch rate of your Bosch process to realise small
scallops and possibly use shorter deposition and etch steps. Should still offer
respectable rate and selectivity.

The second is to run in a non-switching process. Typically this uses a gas ratio
of SF6:C4F8 in the region 1:2 to 1:3 with a moderate ICP power. Adjust the RIE
(bias) power to get a vertical profile. The drawback of this process is that for
a vertical etch the rate is lower than the Bosch process and the selectivity to
mask is typically low - meaning an excessively thick mask is required for
through wafer etching. It is quite a heavily depositing process and so you will
also need to increase your cleaning frequency. It is possible to run in a regime
to obtain sloped or partially-isotropic etch at higher rates and selectivity but
this will typically increase sidewall roughness significantly above your target.

The third is to run an SF6:O2 non-switching process which will give a slightly
higher etch rate than SF6:C4F8 but at room temperature will typically undercut
excessively on deep etches and not have as vertical a sidewall. Running at
cryogenic temperatures  (search "black silicon method" and "Twente") to improve
this is not an option on your system.

Regards,

Mark McNie

-----Original Message-----
From: Ashok . [mailto:ashok@sitarindia.com]
Sent: 03 May 2017 08:46
To: mems-talk@memsnet.org
Subject: -|EXT|- [mems-talk] Through Silicon Via using Non-Bosch recipe

Dear mems-talk community,

I am using SPTS(Orbotech) DRIE ICP etcher for etching TSV but using Bosch
process. since my device process' requirements are with scallops < 20nm,  I am
looking for a recipe (non-bosch) which uses both Etch and Depo steps
simultaneously.
Could you please guide me in this about the possibility of developing the same?

Thanks in advance,
Regards,

Ashok Kumar D,
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