Hello Mr. Wang, Here are a few companies that may be able to assist you: Tygh Silicon 510-371-1223 Crystal Specialties 719-540-0990 Wafer World, Inc 561-842-4441 Silica Source Technology 602-968-3570 If you need any assistance with dicing your silicon wafers or any other material please let me know. We can help you with dicing blades that are used to cut the wafers into die form. Tanaka Systems Inc. offers all Universities a 10% discount on all our products. Mario Robles 650-966-8001 phone 650-966-1881 fax mario@dicingblades.com