Hello Mr. Wang,

Here are a few companies that may be able to assist you:

Tygh Silicon    510-371-1223

Crystal Specialties     719-540-0990

Wafer World, Inc        561-842-4441

Silica Source Technology        602-968-3570

If you need any assistance with dicing your silicon wafers or any other
material please let me know. We can help you with dicing blades that are
used to cut the wafers into die form. Tanaka Systems Inc. offers all
Universities a 10% discount on all our products.

Mario Robles
650-966-8001 phone
650-966-1881 fax
mario@dicingblades.com