Dear Sandra Bermejo Broto,
EV Group has the EV500 series of bonders which can be used for anodic,
thermocompression and silicon direct bonding in one system. Our design and
manufacturing center in Schaerding, Austria (+43 7712 53 11-0) can help you
with any custom requirements for your bond process.
EV Group and its high-volume production partners have produced tens of
millions of anodically bonded MEMS devices on the EV500 series of bonders. I
would refer to the article published in SENSORS on this matter by Electronic
Visions and MIT - A.R. Mirza and A.A. Ayon, SENSORS, December 1998, Vol 15,
No 12, p24-33.
Please e-mail info@evgroup.com for copy of this
review paper on silicon wafer bonding.
Best Regards,
Andy Mirza
Technology Manager
EV Group-Technology, Tel: (602) 437 9492 x 112, Fax: (602) 437 9435
E-mail: a.mirza@evgroup.com , Web:
www.EVGroup.com , Date: 3/29/2000
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-----Original Message-----
From: sandra@eel.upc.es [mailto:sandra@eel.upc.es]
Sent: Friday, March 17, 2000 6:38 AM
To: MEMS@ISI.EDU
Subject: Anodic Bonding
Hello,
I am working in silicon anodic bonding and I would like to
have information
about this technique. I need the name of companies dealing
this field,
since I want to buy the tools to implement it.
Thanks in advance,
Sandra
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Sandra Bermejo Broto
Semiconductor Devices Group (GDS)
Electronic Engineering Department
UPC-Campus Nord, C5
Jordi Girona, 1-3
E-08034 Barcelona
SPAIN
Phone: + 34 93 401 74 81
Fax: + 34 93 401 67 56
e-mail: sandra@eel.upc.es
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