Dear Michael, you should either use Aluminum as sputtered metallization or - if you need the gold on SiO - you should use a adhesion layer between gold an SiO. You could try Ti, TiW, Cr, CrV or CrNi for example. Best regards, Hermann Michael Xiong schrieb: > Dear MEMS colleague: > > I met some problem on gold wire bonding(packaging), > and I highly appreciate your kind instructions. > > I grow SiO2 on Silicon wafer, then deposit gold film > on the SiO2. When I make gold wire bonding to the gold > film on SiO2, I met problem, the gold wire pull off a > small hole on gold film after 1st bonding, it cannot > stick with the gold film. Could you please give me > some instructions? Any information is appreciated. > Thank you in advance. My email: xxghl@yahoo.com > > have a nice day! > > Xiong > > __________________________________________________ > Do You Yahoo!? > Yahoo! Photos - 35mm Quality Prints, Now Get 15 Free! > http://photos.yahoo.com/ -- Dr. Hermann Oppermann Fraunhofer IZM Gustav-Meyer-Allee 25 D-13355 Berlin, Germany -------------------------------------------------- phone: +49-30-46403-163, -160 Fax: +49-30-46403-161 email: oppermn@izm.fhg.de -------------------------------------------------- Dept. Chip Interconnection Technologies Group Optoelectronics, HF and Sensor Integration http://www.izm.fhg.de/ http://www.izm.fhg.de/avt/index.htm http://www.izm.fhg.de/avt/opperm.htm --------------------------------------------------