See Spontaneous direct bonding of thick silicon nitride by Snaches, Gui, and Elwenspoek. J. Micromech. Microeng 7 (1997) pp 111-113 >>> lavriknv@ornl.gov 01/09/02 12:07PM >>> I know that standard bonding processes are available for materials such as Si, oxide and pyrex. Does any one if similar procedures exist for reliable (without organic adhesives) permanent bonding of Si and nitride coated wafers. Any relevant information will be highly appreciated Nickolay _______________________________________________ mems-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.mems-exchange.org/