Abhijat,
        A very simple process to produce patterned Indium is to use metal lift
off. This is almost identical to a process one of my customers is using.  13
micron thick photo resist patterned and reversed then flood expose, develop.
This defines the areas that will be metal.  Bake resist then deposit 7 micron
indium metal and lift off the metal on top of the resist with ultrasonic acetone
wash.  The company that is doing this are producing 7 micron metal contact
points for a flip chip device and have been running it in production for over 10
years.  Resolution is better than any normal resist process, I have seen 800
Angstrom lines and spaces.  The thickest resist we have used for lift off is 40
microns.  I expect some day some one will try  photo sensitive Polymide and go
into the 100 micron range.  Let me know if I can help doing reversal test.  I
have added some technical articles on reversal.  Bill Moffat

-----Original Message-----
From: Abhijat Goyal [mailto:abhijatgoyal@psu.edu]
Sent: Thursday, February 20, 2003 6:29 PM
To: 'General MEMS discussion'
Subject: [mems-talk] indium alloys - deposition and patterning



Hi,

   We are looking for some information on electroplating thick films of
Indium and Indium Based alloys. Are there any vendors that provide the
electrolytes for plating of indium? We are looking at film thickness in
the order of 5-6 microns.

  Also, is it possible to etch Indium? If yes, any suggestions on
possible etchant are welcome.


Thanks and looking forward to responses,

Abhijat

EE MEMS group,
Dept of Electrical Engineering,
Penn State University, PA 16802


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