durusmail
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mems-talk
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thickness variation of SU-8 layer (Oakes Garrett)
Gold pad bonding problem (Guillaume Bougrine)
Ohmic contact on silicon with antimony contamination (Moshe)
Wet release tool for MEMS (Du Bois Bert)
Gold pad bonding problem (Richard B. Keithley)
Adhesion b/w Ni and electroplated Cu (Sardar Bilal)
20um features using AZP4620 (Brubaker Chad)
20um features using AZP4620 (Haixin Zhu)