Dear Knut,

We have made good experiences so far with the TI Prime (beta) adhesion
promoter from MicroChemicals, D-89077 Ulm, Germany, www.microchemicals.com .

We have used the following process:

1. Substrate preparation: After cleaning the substrate with acetone and
subsequently isopropylen, put the substrate on the hotplate at a minimum
temperature of 120°C for 10 minutes to remove adsorbed water from the
substrates surface.
2. Spin coat the TI Prime at approx. 2000-4000 U/min. for approx. 20
seconds. After spin-coating, no residual drops or film of TI Prime should be
visible.
3. Bake the substrate at 120°C for 2 minutes on the hotplate.
4. Proceed with spin-coating the resist immediately!!
(TI Prime contains Titanium. For CMOS processes RCA-cleaning is recommended
after lithography before applying high temperatures).

I hope this helps a little bit.

Regards,

Robert

 -----Original Message-----
From:   Knut Lian [mailto:knut.lian@sensonor.no]
Sent:   Dienstag, 01. Juli 2003 08:08
To:     MEMS (E-mail)
Subject:        [mems-talk] Adhesion promotors for TiN

Dear MEMS collegues,

Does anybody know a suitable adhesion promotor for improving the adhesion of
Shipley 1800 series resist on TiN?

Best regards

Knut Lian
Process Development Engineer
SensoNor asa
www.sensonor.com