You need an adhesion layer. Use ~250 angstroms of Cr, Ti, or Ta.

-Mike


>>> sriramb@blr.bel.co.in 07/26/03 02:42AM >>>
Dear All,

I tried to plate Gold over a Platinum thin film (3000 Angstrom) on
SiO2.
Before the plating, we go through a degreasing step, wherein we boil
the
Silicon wafers in Tri Chloro Ethylene, followed by a dilute HCl dip.
The Pt film is deposited by DC sputtering.

The trouble is that the Pt film peels off when the HCl dip is done.

What should I do to overcome this problem?

Thanks in advance.

Thanking You,
With Best Regards,
Sriram
Senior Process Engineer,
BEL Bangalore
INDIA



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