Hi Sriram, If the sputtering is done well, I don't think you need to go through the degreasing process. maybe you can try and eletroplate Au straight away. good luck, AJ Pang Quoting sriramb: > Dear All, > > I tried to plate Gold over a Platinum thin film (3000 Angstrom) on > SiO2. > Before the plating, we go through a degreasing step, wherein we boil > the > Silicon wafers in Tri Chloro Ethylene, followed by a dilute HCl dip. > > The Pt film is deposited by DC sputtering. > > The trouble is that the Pt film peels off when the HCl dip is done. > > > What should I do to overcome this problem? > > Thanks in advance. > > Thanking You, > With Best Regards, > Sriram > Senior Process Engineer, > BEL Bangalore > INDIA > > > > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your > list > options, visit > http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing > services. > Visit us at http://www.memsnet.org/ > ________________________________________________________________ DISCLAIMER: This e-mail and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom it is addressed. If you are not the intended recipient you are prohibited from using any of the information contained in this e-mail. In such a case, please destroy all copies in your possession and notify the sender by reply e-mail. Heriot Watt University does not accept liability or responsibility for changes made to this e-mail after it was sent, or for viruses transmitted through this e-mail. Opinions, comments, conclusions and other information in this e-mail that do not relate to the official business of Heriot Watt University are not endorsed by it. ________________________________________________________________