In a capacitively coupled RIE with 6" electrodes, we run oxygen plasmas for etching polymers at 200-300 mTorr and 300 W. To clean the chamber, use oxygen at 400mTorr and 300-400W. -Mike >>> Leonard81@vodafone.it 10/17/03 9:33 AM >>> I have done a RIE process on a silicon wafer in a CHF3(80 sccm,3.8*10^-2 mbar) plasma for 1 hour for my degree thesis. I'm looking for a metod to remove the polymer film due to the process on the surface. I have read that it is possible with an oxigen plasma RIE process but I don't know what parameters to use.I'm also interested in a metod to clean the RIE chamber, if it is necessary in this case. Please, help me. Thanks. _______________________________________________ MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.memsnet.org/