Hi,

I am reading many different answers.
>From my experience, if you follow microchem recipes (especially pre bake time)
you might be able to remove SU-8 with their liquid remover. Otherwise, if you
bake it longer (the quantity of solvent left in the SU-8 is lower), you will
need to use dry etching such as O2 +CHF3. I was able to remove 100 um thick SU-
8 with a space of 50 um between 2 copper lines.
I read that you could use salt as well.
many groups published some tricks to remove SU-8, you should take a look. But
like someone mentionned a few days ago, you usually use SU-8 as a part of your
device and not as a photolithography mold !

good luck


>
> ====================================================
> -----Original Message-----
> From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org]
> On Behalf Of ZICKAR Micha?l
> Sent: Wednesday, July 26, 2006 7:35 AM
> To: General MEMS discussion
> Subject: RE: [mems-talk] SU 8 removal
>
> Hi,
>
> If you have large areas of SU-8 a thermal shock - heat the wafer and cool in
> water - might do it. Otherwise think about a SU-8 which has a bad adhesion
> to your substrate (e.g. HMDS priming prior to spinning or sacrificial
> photoresist). As already mentioned, etching SU-8 will be difficult.