Sokwon,
Assuming you're depositing thick Pt (over 1000 A in this case), the trick
that worked for me was to deposit some Pt at a slow rate (0.5 A/s), then
wait a while for it to cool, then deposit some more Pt, etc.

The specific thicknesses and rates you need to use, I don't know. I was
using AZ 5214, and it had been cooked pretty badly by the first deposition
I tried (1800 A at 5 A/s). I was much more cautious the second time around
(500 A at a time, 0.5 A/s). There's probably a higher deposition level
that's happy.
Jesse Fowler



sokwon Paik  writes:

I have hard time in depositing platinum.

  I tried three different size e-beam evaporator but all deposition result
in my PMMA resist damage.

  If resist continues damage, I should go with negative resist for EBL and
need to etch out the other area but I'm afraid whether I could get good
resolution (~10nm) with etching.

  How did you resolve the heat problem? I tried to reduce the evaporation
rate but it seems not very helpful.

  Thank you,

  Sokwon Paik