Dear all

I wish to perform the wafer bonding process between LPCVD deposited
nitride/oxide layers. Will it require cleaning prior to bonding using RCA or
Piranha solution? If yes, the cleaning in Piranha solution (H2SO4+H2O2) is
adequate for successful wafer bonding processAll kinds of suggestions will be
highly appreciated.

Best regards

Prem
Nagoya University