Prem, In our experience, the best method we've seen for a wet chemical activation of surfaces prior to a direct bond is to use a reversed RCA cleaning process, with the HF/BOE portion of the protocol removed. So first clean the substrates using an RCA2 (HCl-H2O2-H2O) clean first, followed by an RCA1 clean (NH4OH-H2O2-H2O), followed by a final DI rinse. This will leave OH groups attached to the surface of the substrates, which will enhance the initial Van der Waals bond force (via hydrogen bonding). Best Regards, Chad Brubaker EV Group invent * innovate * implement Senior Process Technology Engineer - Direct: +1 (480) 305 2414, Main: +1 (480) 305 2400 Fax: +1 (480) 305 2401 Cell: +1 (602) 321 6071 E-Mail: C.Brubaker@EVGroup.com, Web: www.EVGroup.com Prem writes: Dear all I wish to perform the wafer bonding process between LPCVD deposited nitride/oxide layers. Will it require cleaning prior to bonding using RCA or Piranha solution? If yes, the cleaning in Piranha solution (H2SO4+H2O2) is adequate for successful wafer bonding processAll kinds of suggestions will be highly appreciated. Best regards Prem Nagoya University