Hi, I am performing critical dry to release a parallel plate structure, which has SiO2 as a sacrificial layer After removing the sacrifical layer-SiO2 with BOE, then the device is transffered to DI Water and then to Acetone in the critical dry chamber. After performig critical dry process using Polaron-CPD 7501 tool, all the structures are damaged (due to stiction problem). Can anyone, suggest me the accurate process to perform critical dry. Thanks in advance Rama