You can try immersing your devices into IPA (and then methanol, if you prefer) after acetone and then place your devices into CPD. Kagan TOPALLI, Ph. D. Senior Research Engineer MEMS-VLSI and EMT Group Middle East Technical University Dept. of Electrical & Electronics Eng. TR-06531 Ankara Turkey Phone: +90 312 210 44 09 or +90 312 210 23 40 Fax: +90 312 210 23 04 http://www.mems.eee.metu.edu.tr/~topalli/ -- Ramakrishna Kotha wrote: > Hi, > > I am performing critical dry to release a parallel plate structure, which has SiO2 as a sacrificial layer > > After removing the sacrifical layer-SiO2 with BOE, then the device is transffered to DI Water and then to Acetone in the critical dry chamber. After performig critical dry process using Polaron-CPD 7501 tool, all the structures are damaged (due to stiction problem). > > Can anyone, suggest me the accurate process to perform critical dry. > > > Thanks in advance > Rama >