Hi all, I have used polyimide SU8-2000.5 with a process as following: · Spin PR (SU8 2000.5): 10 seconds 500rpm and 30 seconds 3000 rpm (expected PR film thickness 500nm) · Soft bake: 60 seconds · Expose: 5 seconds · Post Expose bake (PEB): bake at 950C in 90 seconds · Development: 70 seconds and rinse in IPA 10 seconds . Hard bake (Cure): 2000C in 15 mins but after all, the SU 8-2000.5 film thickness is only about 300nm, and on the surface some holes occur. how I can get 500nm-thickness film and cure temperature is enough. thanks