Hi; Your hard bake temperature is very high. You should bake less than 2000C in long time. Did you use the standart recipe of the SU8-2000 Tolga YELBOGA Project Engineer Nanotechnology Researh Center Bilkent University Bilkent, Ankara 06800 TURKEY Voice: 90-312-290-1020 http://www.nanointurkey.com http://www.nanotam.bilkent.edu.tr -----Original Message----- From: dai truong [mailto:daitruongvl@yahoo.com] Sent: Friday, August 22, 2008 5:04 AM To: General MEMS discussion Subject: [mems-talk] Polyimide Hi all, I have used polyimide SU8-2000.5 with a process as following: .. Spin PR (SU8 2000.5): 10 seconds 500rpm and 30 seconds 3000 rpm (expected PR film thickness 500nm) .. Soft bake: 60 seconds .. Expose: 5 seconds .. Post Expose bake (PEB): bake at 950C in 90 seconds .. Development: 70 seconds and rinse in IPA 10 seconds . Hard bake (Cure): 2000C in 15 mins but after all, the SU 8-2000.5 film thickness is only about 300nm, and on the surface some holes occur. how I can get 500nm-thickness film and cure temperature is enough. thanks