Thank you very much, Indeed, I am told by the Tegal company that I cannot go below 1.5Torr otherwise I may damage the instrument. With your comment, I will try to found out this mean free path and see if I can use our instrument to etch the polyimide. Thank you again :-) Suzanne Paradis, eng. M.Sc. -----Original Message----- From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On Behalf Of Samadhan B. Patil Sent: July 6, 2009 4:43 PM To: General MEMS discussion Subject: Re: [mems-talk] Removal of polyimide sacrificial layer Hi Suzanne, To remove a sacrificial layer using asher, pressure in the chamber should be such that the mean free path (of the species in a plasma) is less than the thickness of the sacrificial layer. I dont know much about the "Tegal 903E plasma etcher" but you will need to find a compramise between too high pressure and the pressure just enough to give less mean free path. Rough calculations should help you to decide this pressure. Regarding warpage of the bridge, it can be because of the residual stress in the structural layer and may arise because of a difference in the thermal expansion co-efficient of polyimide and the structural layer (or deposition temperature of the structural layer). regards, Samadhan