Hi,

The aspect ratio seems ok, so you may need to check the sputtering
direction. If the gold was not sputtered normally on the PR, the side
wall was also possibly covered by the gold. Thus it was difficult to
lift off PR in acetone.

Dongxiao

On Tue, Jul 14, 2009 at 2:06 PM, Shah, Forum N wrote:
> Hello everyone,
>
> I am trying to do the lift-off process for the first time but am not able to
achieve it. Its
> been over 24 hrs that the wafer is immersed in acetone but the gold film is
not leaving
> the Si substrate.
>
> Details of the process are:
> I have spun SPR 220-3 on a SI wafer near 3 micron of a thickness. After
exposing and
> developing it, I sputtered 100 angstrom gold film.
>
> Please guide me on how to do a lift off process. And if acetone is sufficient
for doing lift-off
> or do I need any other solvent or chemical?
>
> Thanks
> Forum